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High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.
Manho Lee
Daniel H. Jung
Heegon Kim
Jonghyun Cho
Joungho Kim
Published in:
IEEE Des. Test (2016)
Keyphrases
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high frequency
high speed
high resolution
low frequency
computer vision
wavelet transform
multispectral
low power