Login / Signup

Modeling and analysis of open defect in through silicon via (TSV) channel.

Daniel H. JungHeegon KimJonghoon J. KimJoungho KimHyun-Cheol BaeKwang-Seong Choi
Published in: EMC Compo (2013)
Keyphrases
  • artificial neural networks
  • statistical analysis
  • real time
  • data analysis
  • quantitative analysis
  • structural analysis
  • data sets
  • information systems
  • image sequences
  • low cost
  • steady state