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Fault detection and isolation of multiple defects in through silicon via (TSV) channel.

Daniel H. JungHeegon KimJonghoon J. KimSukjin KimJoungho KimHyun-Cheol BaeKwang-Seong Choi
Published in: 3DIC (2014)
Keyphrases
  • fault detection and isolation
  • low cost
  • multi channel
  • high speed
  • decision making
  • test cases
  • closed loop
  • industrial processes