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Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.

Dong Gun KamJoungho KimJiheon YuHo ChoiKicheol BaeChoonheung Lee
Published in: IEEE Des. Test Comput. (2006)
Keyphrases
  • wire bonding
  • bond pad
  • stress response
  • grid points
  • grid computing
  • link structure
  • linear array
  • web services
  • grid enabled