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Packaging a 40-Gbps Serial Link Using a Wire-Bonded Plastic Ball Grid Array.
Dong Gun Kam
Joungho Kim
Jiheon Yu
Ho Choi
Kicheol Bae
Choonheung Lee
Published in:
IEEE Des. Test Comput. (2006)
Keyphrases
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wire bonding
bond pad
stress response
grid points
grid computing
link structure
linear array
web services
grid enabled