Miniaturized and high-performance RF packages with ultra-thin glass substrates.

Min Suk KimMarkondeya Raj PulugurthaYoungwoo KimGapyeol ParkKyungjun ChoVanessa SmetVenky SundaramJoungho KimRao R. Tummala
Published in: Microelectron. J. (2018)
Keyphrases