Daehyun Chung

Publication Activity (10 Years)

Years Active: 2006-2009
Publications (10 Years): 0

Publications

Tapobrata Bandyopadhyay, Ritwik Chatterjee, Daehyun Chung, Madhavan Swaminathan, Rao R. Tummala
Electrical modeling of Through Silicon and Package Vias. 3DIC (2009)
Jianyong Xie, Daehyun Chung, Madhavan Swaminathan, Michael McAllister, Alina Deutsch, Lijun Jiang, Barry J. Rubin
Electrical-thermal co-analysis for power delivery networks in 3D system integration. 3DIC (2009)
Daehyun Chung, Chunghyun Ryu, Hyungsoo Kim, Choonheung Lee, Jinhan Kim, Kicheol Bae, Jiheon Yu, Hoi-Jun Yoo, Joungho Kim
Chip-package hybrid clock distribution network and DLL for low jitter clock delivery. IEEE J. Solid State Circuits 41 (1) (2006)