• search
    search
  • reviewers
    reviewers
  • feeds
    feeds
  • assignments
    assignments
  • settings
  • logout

Electrical modeling of Through Silicon and Package Vias.

Tapobrata BandyopadhyayRitwik ChatterjeeDaehyun ChungMadhavan SwaminathanRao R. Tummala
Published in: 3DIC (2009)
Keyphrases
  • high density
  • three dimensional
  • low cost