TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC.

Moongon Jung Joydeep Mitra David Z. Pan Sung Kyu Lim

Published in: Commun. ACM (2014)

Keyphrases

reliability analysis
high speed
optimization algorithm
optimization process
low cost
optimization model
high density
optimization problems
databases
data mining
objective function
integrated circuit