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Novel crack sensor for TSV-based 3D integrated circuits: design and deployment perspectives.

Chun ZhangMoongon JungSung Kyu LimYiyu Shi
Published in: ICCAD (2013)
Keyphrases
  • integrated circuit
  • artificial intelligence
  • user interface
  • sensor networks
  • knowledge based systems
  • design patterns
  • printed circuit boards
  • real time
  • control system
  • mobile robot
  • sensor data
  • data fusion