Patrick Morrow

Publication Activity (10 Years)

Years Active: 2006-2023
Publications (10 Years): 1

Top Topics

Significantly Reduced

Artificial Intelligence

Integrated Circuit

Top Venues

VLSI Technology and Circuits

Publications

Mauro J. Kobrinsky, J. D. Silva, E. Mannebach, S. Mills, M. Abd El Qader, O. Adebayo, N. Arkali Radhakrishna, M. Beasley, J. Chawla, S. Chugh, A. Dasgupta, U. Desai, E. De Re, G. Dewey, T. Edwards, C. Engel, V. Gudmundsson, Jeffery Hicks, B. Krist, R. Mehandru, Inanc Meric, Patrick Morrow, D. Nandi, P. Patel, R. Ramamurthy, D. Samanta, L. Shoer, A. St Amour, L. H. Tan, Sukru Yemenicioglu, X. Wang, T. Ghani
Novel Cell Architectures with Back-side Transistor Contacts for Scaling and Performance. VLSI Technology and Circuits (2023)
Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC (2013)
Young-Joon Lee, Patrick Morrow, Sung Kyu Lim
Ultra high density logic designs using transistor-level monolithic 3D integration. ICCAD (2012)
Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Patrick Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb
Die Stacking (3D) Microarchitecture. MICRO (2006)