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Die Stacking (3D) Microarchitecture.

Bryan BlackMurali AnnavaramNed BrekelbaumJohn DeValeLei JiangGabriel H. LohDon McCaulePatrick MorrowDonald W. NelsonDaniel PantusoPaul ReedJeff RupleySadasivan ShankarJohn Paul ShenClair Webb
Published in: MICRO (2006)
Keyphrases
  • early stage
  • circuit design
  • combining multiple
  • ensemble learning
  • probabilistic model
  • model averaging
  • pattern recognition
  • feature vectors
  • active learning
  • co occurrence