Clair Webb

Publication Activity (10 Years)

Years Active: 2002-2013
Publications (10 Years): 0

Top Topics

Significantly Reduced

Top Venues

Publications

Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC (2013)
Muhammad M. Khellah, Nam-Sung Kim, Yibin Ye, Dinesh Somasekhar, Tanay Karnik, Nitin Borkar, Gunjan Pandya, Fatih Hamzaoglu, Tom Coan, Yih Wang, Kevin Zhang, Clair Webb, Vivek De
Process, Temperature, and Supply-Noise Tolerant 45nm Dense Cache Arrays With Diffusion-Notch-Free (DNF) 6T SRAM Cells and Dynamic Multi-Vcc Circuits. IEEE J. Solid State Circuits 44 (4) (2009)
Bryan Black, Murali Annavaram, Ned Brekelbaum, John DeVale, Lei Jiang, Gabriel H. Loh, Don McCaule, Patrick Morrow, Donald W. Nelson, Daniel Pantuso, Paul Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb
Die Stacking (3D) Microarchitecture. MICRO (2006)
Bryan Black, Donald Nelson, Clair Webb, Nick Samra
3D Processing Technology and Its Impact on iA32 Microprocessors. ICCD (2004)
Atila Alvandpour, Ram Krishnamurthy, Shekhar Borkar, A. Rahman, Clair Webb
A burn-in tolerant dynamic circuit technique. CICC (2002)