Yang Wan

Publication Activity (10 Years)

Years Active: 2011-2024
Publications (10 Years): 9

Top Topics

Financial Crisis

Manufacturing Enterprises

Top Venues

Comput. Aided Des.

IEEE/ACM Trans. Netw.

Publications

Zhaoyu Xing, Yang Wan, Juan Wen, Wei Zhong
GOLFS: feature selection via combining both global and local information for high dimensional clustering. Comput. Stat. 39 (5) (2024)
Jianxu Liu, Yang Wan, Songze Qu, Ruihan Qing, Songsak Sriboonchitta
Dynamic Correlation between the Chinese and the US Financial Markets: From Global Financial Crisis to COVID-19 Pandemic. Axioms 12 (1) (2023)
Yongping Zhang, Ying Cheng, Haoyu Wang, Yang Wan, Feng Xiang, Fei Tao
Variable-Utility-Aware Manufacturing Service Collaboration Optimization Toward Industrial Internet Platforms. IEEE Trans. Syst. Man Cybern. Syst. 53 (10) (2023)
Guang Li, Yang Wan, Jie Guo, Fengshan Ma, Haijun Zhao, Zhiqing Li
A Case Study on Ground Subsidence and Backfill Deformation Induced by Multi-Stage Filling Mining in a Steeply Inclined Ore Body. Remote. Sens. 14 (18) (2022)
Jia Liu, Fengshan Ma, Guang Li, Jie Guo, Yang Wan, Yewei Song
Evolution Assessment of Mining Subsidence Characteristics Using SBAS and PS Interferometry in Sanshandao Gold Mine, China. Remote. Sens. 14 (2) (2022)
Xinyu Tong, Yang Wan, Qianru Li, Xiaohua Tian, Xinbing Wang
CSI Fingerprinting Localization With Low Human Efforts. IEEE/ACM Trans. Netw. 29 (1) (2021)
Yang Wan, Alice Lux-Fawzi, Haneesh Kesari
Determining rigid body motion from accelerometer data through the square-root of a negative semi-definite tensor, with applications in mild traumatic brain injury. CoRR (2021)
Yang Wan, Tianju Xue, Yongxing Shen
The successive node snapping scheme for an evolving branched curve in 2D and 3D. Comput. Aided Des. 111 (2019)
Xinyu Tong, Fengyuan Zhu, Yang Wan, Xiaohua Tian, Xinbing Wang
Batch Localization Based on OFDMA Backscatter. Proc. ACM Interact. Mob. Wearable Ubiquitous Technol. 3 (1) (2019)
Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, Sung Kyu Lim
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC (2014)
Moongon Jung, Taigon Song, Yang Wan, Young-Joon Lee, Debabrata Mohapatra, Hong Wang, Greg Taylor, Devang Jariwala, Vijay Pitchumani, Patrick Morrow, Clair Webb, Paul Fischer, Sung Kyu Lim
How to reduce power in 3D IC designs: A case study with OpenSPARC T2 core. CICC (2013)
Xin Zhao, Yang Wan, Michael Scheuermann, Sung Kyu Lim
Transient modeling of TSV-wire electromigration and lifetime analysis of power distribution network for 3D ICs. ICCAD (2013)
Jie Tang, Sen Wu, Bo Gao, Yang Wan
Topic-level social network search. KDD (2011)