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TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC.
Moongon Jung
Joydeep Mitra
David Z. Pan
Sung Kyu Lim
Published in:
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. (2012)
Keyphrases
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reliability analysis
optimization algorithm
optimization problems
optimization model
low cost
high speed
evolutionary algorithm
neural network
objective function
object oriented
optimization method
high density
fault tree