Login / Signup
Failure analysis of through-silicon vias in free-standing wafer under thermal-shock test.
Xi Liu
Qiao Chen
Venkatesh Sundaram
Rao R. Tummala
Suresh K. Sitaraman
Published in:
Microelectron. Reliab. (2013)
Keyphrases
</>
integrated circuit
statistical analysis
high density
knowledge base
image analysis
artificial intelligence
massively parallel
mathematical analysis
finite element analysis