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Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies.
Ye Tian
Xi Liu
Justin Chow
Yi-Ping Wu
Suresh K. Sitaraman
Published in:
Microelectron. Reliab. (2014)
Keyphrases
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experimental evaluation
failure rate
printed circuit boards
low cost
high density
circuit design
physical design
programmable logic
high temperature
single chip
reliability analysis
evolvable hardware
solid models
host computer