Richard F. Indyk

Publication Activity (10 Years)

Years Active: 1991-2016
Publications (10 Years): 1

Top Topics

Software Packages

Top Venues

Microelectron. Reliab.

Publications

Shrikant Swaminathan, Kamal K. Sikka, Richard F. Indyk, Tuhin Sinha
Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages. Microelectron. Reliab. 66 (2016)
John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk
IBM System/390 air-cooled alumina thermal conduction module. IBM J. Res. Dev. 35 (3) (1991)