Through-silicon-via-based double-side integrated microsystem for neural sensing applications.
Chih-Wei ChangPo-Tsang HuangLei-Chun ChouShang-Lin WuShih-Wei LeeChing-Te ChuangKuan-Neng ChenJin-Chern ChiouWei HwangYen-Chi LeeChung-Hsi WuKuo-Hua ChenChi-Tsung ChiuHo-Ming TongPublished in: ISSCC (2013)