Reliability investigation and mechanism analysis for a novel bonding method of flexible substrate in 3D integration.
Yu-Tao YangYu-Chen HuKuan-Neng ChenPublished in: 3DIC (2016)
Keyphrases
- high accuracy
- statistical analysis
- theoretical analysis
- cost function
- significant improvement
- pairwise
- high precision
- experimental evaluation
- prior knowledge
- computational complexity
- dynamic programming
- similarity measure
- feature selection
- computationally efficient
- preprocessing
- objective function
- image processing
- learning algorithm
- detection method
- neural network