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Design Considerations and Fabrication Challenges of Surface Electrode Ion Trap with TSV Integration.
Jing Tao
Hongyu Li
Peng Zhao
Yu Dian Lim
Anak Agung Alit Apriyana
Chuan Seng Tan
Published in:
3DIC (2019)
Keyphrases
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mobile devices
design considerations
lessons learned
three dimensional
surface reconstruction
d objects
random access memory
real world
key issues
high density
data integration
object surface
thin film transistor
high speed
multi view
integrated circuit
high resolution
surface fitting
low voltage