Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack.

Shiv Govind Singh Chuan Seng Tan

Published in: 3DIC (2009)

Keyphrases

multi layer
room temperature
thermal imaging
high temperature
neural network
thin film

heat transfer
neural nets
single layer
semiconductor devices
feed forward neural networks
thermal conductivity

infrared
air temperature
error back propagation
chemical vapor deposition
feed forward
field effect transistors

object recognition
space charge
training data
face recognition
feature selection