Impact of thermal through silicon via (TTSV) on the temperature profile of multi-layer 3-D device stack.
Shiv Govind SinghChuan Seng TanPublished in: 3DIC (2009)
Keyphrases
- multi layer
- room temperature
- thermal imaging
- high temperature
- neural network
- thin film
- heat transfer
- neural nets
- single layer
- semiconductor devices
- feed forward neural networks
- thermal conductivity
- infrared
- air temperature
- error back propagation
- chemical vapor deposition
- feed forward
- field effect transistors
- object recognition
- space charge
- training data
- face recognition
- feature selection