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Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.

Cher Ming TanKim Peng LimTai Chong ChaiGuat Cheng Lim
Published in: Microelectron. Reliab. (2005)
Keyphrases
  • semiconductor devices
  • integrated circuit
  • electron beam
  • chip design
  • building blocks
  • high density
  • printed circuit boards
  • power dissipation
  • wide range
  • high speed
  • low density
  • real time
  • circuit design
  • density function