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Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist.
Cher Ming Tan
Kim Peng Lim
Tai Chong Chai
Guat Cheng Lim
Published in:
Microelectron. Reliab. (2005)
Keyphrases
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semiconductor devices
integrated circuit
electron beam
chip design
building blocks
high density
printed circuit boards
power dissipation
wide range
high speed
low density
real time
circuit design
density function