Login / Signup
Experimental investigation on the impact of stress free temperature on the electromigration performance of copper dual damascene submicron interconnect.
Arijit Roy
Cher Ming Tan
Published in:
Microelectron. Reliab. (2006)
Keyphrases
</>
integrated circuit
electron beam
printed circuit boards
semiconductor devices
vlsi circuits
high speed
neural network
decision trees
factors that influence
database
information technology
wireless sensor networks
thin film
high impact