A Novel Wafer-Level Packaging Solution For Mems.

Zhenfeng Wang G. J. Qi Jun Wei Peck Cheng Lim Yufeng Jin C. K. Wong

Published in: Int. J. Comput. Eng. Sci. (2003)

Keyphrases

high density
high speed
exact solution
information systems
levels of abstraction
mathematical model
hidden markov models
linear equations
closed form
higher level
real world
expert systems
optimal solution
bayesian networks
high level
computer vision
artificial intelligence