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Numerical and experimental study on Cu protrusion of Cu-filled through-silicon vias (TSV).
F. X. Che
W. N. Putra
A. Heryanto
A. Trigg
S. Gao
Chee Lip Gan
Published in:
3DIC (2011)
Keyphrases
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experimental study
high density
mechanical properties
electron microscopy
experimental evaluation
high speed
sensitivity analysis
thin film
low cost
markov chain
finite difference
steady state
genetic algorithm
integrated circuit
synthetic datasets
x ray
numerical data
numerical analysis
multiscale