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Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods.
Hongbin Shi
F. X. Che
Cuihua Tian
Rui Zhang
Jong Tae Park
Toshitsugu Ueda
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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finite element methods
image processing
image analysis