Toshitsugu Ueda

Publication Activity (10 Years)

Years Active: 2000-2019
Publications (10 Years): 6

Top Topics

Top Venues

IEEE Trans. Biomed. Eng.

Publications

Masataka Fujimoto, Masahiro Okuda, Shinji Yoshii, Satoshi Ikezawa, Toshitsugu Ueda, Herve Tassery, Frédéric J. G. Cuisinier, Chiaki Kitamura
Endoscopic System Based on Intraoral Camera and Image Processing. IEEE Trans. Biomed. Eng. 66 (4) (2019)
Hiroshi Oigawa, Mizuho Shimojima, Tooru Tsuno, Fusao Kohsaka, Toshitsugu Ueda
Sensitivity of improvement of quartz hydrogen sensor with novel designed heater. ICST (2017)
Jinxing Liang, Jing Zhang, Wenxiang Zhou, Toshitsugu Ueda
Development of a Flow Injection Based High Frequency Dual Channel Quartz Crystal Microbalance. Sensors 17 (5) (2017)
Satoshi Ikezawa, Jun Yamamoto, Toshitsugu Ueda
Development of helium-microwave-induced plasma-atomic emission spectroscopy system with two-way spectroscopic analysis. ICST (2015)
Jinxing Liang, Liyuan Zhang, Ling Wang, Yuan Dong, Toshitsugu Ueda
Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer. Sensors 15 (9) (2015)
Masataka Fujimoto, Shinji Yoshii, Chiaki Kitamura, Satoshi Ikezawa, Toshitsugu Ueda
Development of dental endoscope for root-canal observation. ICST (2015)
Jinxing Liang, Jia Huang, Tian Zhang, Jing Zhang, Xuefeng Li, Toshitsugu Ueda
An Experimental Study on Fabricating an Inverted Mesa-Type Quartz Crystal Resonator Using a Cheap Wet Etching Process. Sensors 13 (9) (2013)
Hongbin Shi, F. X. Che, Cuihua Tian, Rui Zhang, Jong Tae Park, Toshitsugu Ueda
Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods. Microelectron. Reliab. 52 (9-10) (2012)
Rui Zhang, Hongbin Shi, Yuehong Dai, Jong Tae Park, Toshitsugu Ueda
Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model. Microelectron. Reliab. 52 (9-10) (2012)
Hongbin Shi, Toshitsugu Ueda
Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test. Microelectron. Reliab. 51 (9-11) (2011)
Hongbin Shi, Faxing Che, Toshitsugu Ueda
Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending. Microelectron. Reliab. 51 (9-11) (2011)
Yuji Yokoyama, Nobutaka Itoh, Masatoshi Hasegawa, Masahiro Katayama, Hiroshi Akasaki, Masayuki Kaneda, Toshitsugu Ueda, Yousuke Tanaka, Eiji Yamasaki, Masaya Todokoro, Keinosuke Toriyama, Hiroshi Miki, Masayoshi Yagyu, Kazumasa Takashima, Toru Kobayashi, Syuichi Miyaoka, Nobuo Tamba
A 1.8-V embedded 18-Mb DRAM macro with a 9-ns RAS access time and memory-cell area efficiency of 33%. IEEE J. Solid State Circuits 36 (3) (2001)
Yuji Yokoyama, Nybutaka Itoh, Masap Katayama, Kazumasa Takashima, Hiroshi Akasaki, Masayuki Kaneda, Toshitsugu Ueda, Yousuke Tanaka, Eiji Yamasaki, Masaya Todokoro, Keinosuke Toriyama, Hiroshi Miki, Masayoshi Yagyu, Tom Kobayashi, Syuichi Miyaoka, Nobuo Tamba
A 1.8-V embedded 18-Mb DRAM macro with a 9-ns RAS access time and memory cell efficiency of 33%. CICC (2000)