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Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test.

Hongbin ShiToshitsugu Ueda
Published in: Microelectron. Reliab. (2011)
Keyphrases
  • comparative study
  • climbing robot
  • failure rate
  • mechanical properties
  • social networks
  • database systems
  • real time
  • d objects
  • statistical tests
  • motion planning
  • programmable logic