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Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer.
Jinxing Liang
Liyuan Zhang
Ling Wang
Yuan Dong
Toshitsugu Ueda
Published in:
Sensors (2015)
Keyphrases
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high speed
low cost
high density
analog vlsi
programmable logic
activity recognition
gesture recognition
physical design
touch screen
cross section
vlsi design
single chip
physical activity
mobile devices
solid models
reinforced concrete
high bandwidth
electron beam
circuit design
genetic algorithm
micron cmos