Flip Chip Bonding of a Quartz MEMS-Based Vibrating Beam Accelerometer.

Jinxing Liang Liyuan Zhang Ling Wang Yuan Dong Toshitsugu Ueda

Published in: Sensors (2015)

Keyphrases

high speed
low cost
high density
analog vlsi
programmable logic
activity recognition
gesture recognition
physical design
touch screen
cross section
vlsi design
single chip
physical activity
mobile devices
solid models
reinforced concrete
high bandwidth
electron beam
circuit design
genetic algorithm
micron cmos