Johan Liu

Publication Activity (10 Years)

Years Active: 2003-2017
Publications (10 Years): 2

Top Topics

Mechanical Properties

Feasible Solution

High Temperature

Graphical Interface

Top Venues

Microelectron. Reliab.

Publications

Ee-Hua Wong, Johan Liu
Interface and interconnection stresses in electronic assemblies - A critical review of analytical solutions. Microelectron. Reliab. 79 (2017)
Shuangxi Sun, Si Chen, Xin Luo, Yifeng Fu, Lilei Ye, Johan Liu
Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging. Microelectron. Reliab. 56 (2016)
C. Andersson, D. R. Andersson, Per-Erik Tegehall, Johan Liu
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. Microelectron. Reliab. 47 (2-3) (2007)
Zhimin Mo, Helge Kristiansen, Morten Eliassen, Shiming Li, Johan Liu
Study on thermomechanical reliability of a tunable light modulator. Microelectron. Reliab. 44 (5) (2004)
Li-Rong Zheng, Johan Liu
System-on-package: a broad perspective from system design to technology development. Microelectron. Reliab. 43 (8) (2003)
Johan Liu
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5. Microelectron. Reliab. 43 (4) (2003)