Per-Erik Tegehall

Publication Activity (10 Years)

Years Active: 2007-2015
Publications (10 Years): 0

Top Topics

Top Venues

Microelectron. Reliab.

Publications

Per-Erik Tegehall, Göran Wetter
Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints. Microelectron. Reliab. 55 (11) (2015)
C. Andersson, D. R. Andersson, Per-Erik Tegehall, Johan Liu
Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints. Microelectron. Reliab. 47 (2-3) (2007)