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Effect of different temperature cycling profiles on the crack initiation and propagation of Sn-3.5Ag wave soldered solder joints.

C. AnderssonD. R. AnderssonPer-Erik TegehallJohan Liu
Published in: Microelectron. Reliab. (2007)
Keyphrases
  • wave propagation
  • artificial intelligence
  • image segmentation
  • multiscale
  • numerical simulations
  • simplex method