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Impact of laminate cracks under solder pads on the fatigue lives of ball grid array solder joints.

Per-Erik TegehallGöran Wetter
Published in: Microelectron. Reliab. (2015)
Keyphrases
  • factors that influence
  • digital images
  • infrared
  • grid computing
  • high impact
  • database
  • video sequences
  • high speed
  • grid enabled