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Mechanical and thermal characterization of a novel nanocomposite thermal interface material for electronic packaging.
Shuangxi Sun
Si Chen
Xin Luo
Yifeng Fu
Lilei Ye
Johan Liu
Published in:
Microelectron. Reliab. (2016)
Keyphrases
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infrared
data sets
high speed
solder ball connect
power plant
thermal images
high temperature
thermal imaging
electrical power
artificial intelligence
control system
high density
finite element analysis
mechanical properties
visible spectrum