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Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package.

Yong HanBoon Long LauBoo Yang JungXiaowu Zhang
Published in: IEEE Des. Test (2015)
Keyphrases
  • software package
  • image processing
  • data structure
  • real time
  • artificial intelligence
  • web services
  • database systems
  • high speed
  • embedded systems