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Boo Yang Jung
Publication Activity (10 Years)
Years Active: 2015-2015
Publications (10 Years): 0
Top Topics
High Speed
Software Package
Artificial Intelligence
Top Venues
IEEE Des. Test
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Publications
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Yong Han
,
Boon Long Lau
,
Boo Yang Jung
,
Xiaowu Zhang
Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package.
IEEE Des. Test
32 (4) (2015)