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Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying OngSoon Wee HoKripesh VaidyanathanVasarla Nagendra SekharMing Chinq JongSamuel Lim Yak LongVincent Lee Wen ShengLeong Ching WaiVempati Srinivasa RaoJimmy OngXuefen OngXiaowu ZhangYoon Uk SeungJohn H. LauYeow Kheng LimDavid YeoKai Chong ChanZhang YanfengJuan Boon TanDong Kyun Sohn
Published in: Microelectron. Reliab. (2010)
Keyphrases
  • single chip
  • data sets
  • case study
  • high speed
  • physical design
  • user interface
  • low cost
  • computer aided
  • design methodology
  • printed circuit boards
  • analog vlsi
  • chip design