Jing-en Luan

Publication Activity (10 Years)

Years Active: 2007-2010
Publications (10 Years): 0

Publications

Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton
Interface delamination analysis of TQFP package during solder reflow. Microelectron. Reliab. 50 (7) (2010)
Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47 (2-3) (2007)