Interface delamination analysis of TQFP package during solder reflow.

Hu Guojun Roberto Rossi Jing-en Luan Xavier Baraton

Published in: Microelectron. Reliab. (2010)

Keyphrases

statistical analysis
quantitative analysis
database
user interface
automatic analysis
real time
computer vision
optimal solution
information technology
multiresolution
user friendly
finite element