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Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.

Tong Yan TeeHun Shen NgZhaowei Zhong
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • reliability analysis
  • high speed
  • low cost
  • printed circuit boards
  • neural network
  • case study
  • data analysis
  • text mining
  • computational intelligence
  • stress response
  • fault tree