Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis.

Tong Yan TeeZhaowei Zhong
Published in: Microelectron. Reliab. (2004)
Keyphrases
  • data sets
  • neural network
  • data analysis
  • x ray
  • computer vision
  • statistical modeling
  • model validation