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Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.

Tong Yan TeeHun Shen NgDaniel YapXavier BaratonZhaowei Zhong
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • failure rate
  • software reliability
  • database
  • website
  • three dimensional
  • higher level
  • multiscale
  • test set
  • levels of abstraction
  • database systems
  • video sequences
  • search algorithm
  • anomaly detection
  • test cases