Tadatomo Suga

Publication Activity (10 Years)

Years Active: 2002-2023
Publications (10 Years): 4

Top Topics

Nonparametric Regression

Top Venues

IEICE Trans. Electron.

Sci. China Inf. Sci.

Microelectron. Reliab.

Int. J. Autom. Technol.

Publications

Hangning Shi, Ailun Yi, Jiaxin Ding, Xudong Liu, Qingcheng Qin, Juemin Yi, Junjie Hu, Miao Wang, Demin Cai, Jianfeng Wang, Ke Xu, Fengwen Mu, Tadatomo Suga, René Heller, Mao Wang, Shengqiang Zhou, Wenhui Xu, Kai Huang, Tiangui You, Xin Ou
Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology. Sci. China Inf. Sci. 66 (11) (2023)
Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi
Film and Direct Transfer for Smoothing Au Surfaces. Int. J. Autom. Technol. 13 (2) (2019)
Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method. IEICE Trans. Electron. (2) (2017)
Eiji Higurashi, Michitaka Yamamoto, Takeshi Sato, Tadatomo Suga, Renshi Sawada
Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration. IEICE Trans. Electron. (3) (2016)
Masahisa Fujino, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer. Microelectron. Reliab. 55 (12) (2015)
Chenxi Wang, Tadatomo Suga
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials. Microelectron. Reliab. 52 (2) (2012)
Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. Microelectron. Reliab. 52 (2) (2012)
Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging. Microelectron. Reliab. 52 (2) (2012)
Tadatomo Suga, Ryuichi Kondoh
Low temperature bonding for 3D interconnects. 3DIC (2011)
Eiji Higurashi, Daisuke Chino, Tadatomo Suga
Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals. IEICE Trans. Electron. (2) (2009)
Eiji Higurashi, Renshi Sawada, Tadatomo Suga
Optical Microsensors Integration Technologies for Biomedical Applications. IEICE Trans. Electron. (2) (2009)
Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi
/Si Structure Achieved in Ambient Air. IEICE Trans. Electron. (1) (2007)
Kenichi Kataoka, Toshihiro Itoh, Tadatomo Suga
Low Contact-Force Fritting Probe Card Using Buckling Microcantilevers. ITC (2003)
Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. Microelectron. Reliab. 43 (5) (2003)
Kenichi Kataoka, Toshihiro Itoh, Katsuya Okumura, Tadatomo Suga
Low-Contact-Force Probing on Copper Electrodes. ITC (2002)