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Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.

Qian WangNaoe HosodaToshihiro ItohTadatomo Suga
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • significant improvement
  • cost function
  • dynamic programming
  • detection method
  • surface features
  • feature extraction
  • computational complexity
  • computational cost
  • segmentation method
  • reconstruction method
  • surface shape