Login / Signup
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.
Qian Wang
Naoe Hosoda
Toshihiro Itoh
Tadatomo Suga
Published in:
Microelectron. Reliab. (2003)
Keyphrases
</>
significant improvement
cost function
dynamic programming
detection method
surface features
feature extraction
computational complexity
computational cost
segmentation method
reconstruction method
surface shape