Naoe Hosoda

Publication Activity (10 Years)

Years Active: 2003-2003
Publications (10 Years): 0

Publications

Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method. Microelectron. Reliab. 43 (5) (2003)