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Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.

Eiji HigurashiKen OkumuraYutaka KunimuneTadatomo SugaKei Hagiwara
Published in: IEICE Trans. Electron. (2017)
Keyphrases
  • thin film
  • room temperature
  • control system
  • low cost