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Kei Hagiwara
Publication Activity (10 Years)
Years Active: 2015-2023
Publications (10 Years): 5
Top Topics
Metal Oxide Semiconductor
Digital Camera
Cmos Image Sensor
Wide Dynamic Range
Top Venues
3DIC
ISGT Asia
ISCAS
IEICE Trans. Electron.
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Publications
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Kei Hagiwara
,
Yu Fujimoto
,
Yasuhiro Kodama
,
Yasuhiro Hayashi
,
Ryo Maeda
,
Kohei Oishi
,
Kenjiro Mori
Prioritization of Distribution Networks with Distributed Energy Resources for Efficient Deployment of Loss Minimum Reconfiguration Technology.
ISGT Asia
(2023)
Masahide Goto
,
Joeri De Vos
,
Toshihisa Watabe
,
Kei Hagiwara
,
Masakazu Nanba
,
Yoshinori Iguchi
,
Eiji Higurashi
,
Yuki Honda
,
Takuya Saraya
,
Masaharu Kobayashi
,
Hiroshi Toshiyoshi
,
Toshiro Hiramoto
Triple-Layering Technology for Pixel-Parallel CMOS Image Sensors Developed by Hybrid Bonding of SOI Wafers.
3DIC
(2019)
Masahide Goto
,
Yuki Honda
,
Toshihisa Watabe
,
Kei Hagiwara
,
Masakazu Nanba
,
Yoshinori Iguchi
,
Takuya Saraya
,
Masaharu Kobayashi
,
Eiji Higurashi
,
Hiroshi Toshiyoshi
,
Toshiro Hiramoto
Quarter Video Graphics Array Full-Digital Image Sensing with Wide Dynamic Range and Linear Output Using Pixel-Wise 3D Integration.
ISCAS
(2018)
Eiji Higurashi
,
Ken Okumura
,
Yutaka Kunimune
,
Tadatomo Suga
,
Kei Hagiwara
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.
IEICE Trans. Electron.
(2) (2017)
Masahide Goto
,
Kei Hagiwara
,
Yoshinori Iguchi
,
Hiroshi Ohtake
,
Takuya Saraya
,
Masaharu Kobayashi
,
Eiji Higurashi
,
Hiroshi Toshiyoshi
,
Toshiro Hiramoto
Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers.
3DIC
(2015)