Three-dimensional integrated circuits and stacked CMOS image sensors using direct bonding of SOI layers.
Masahide GotoKei HagiwaraYoshinori IguchiHiroshi OhtakeTakuya SarayaMasaharu KobayashiEiji HigurashiHiroshi ToshiyoshiToshiro HiramotoPublished in: 3DIC (2015)
Keyphrases
- image sensor
- integrated circuit
- three dimensional
- dynamic range
- video camera
- low power
- single chip
- image processing algorithms
- metal oxide semiconductor
- hardware and software
- imaging systems
- digital camera
- solid state
- motion blur
- cmos technology
- cmos image sensor
- multi view
- image processing
- x ray
- image sequences
- power consumption
- silicon on insulator
- high speed
- low cost
- video sequences
- video data
- computer systems
- dynamic scenes