Akitsu Shigetou

Publication Activity (10 Years)

Years Active: 2011-2019
Publications (10 Years): 2

Top Topics

Information Integration

Database Replication

Evaluation Metrics

Top Venues

Microelectron. Reliab.

Publications

Akitsu Shigetou, Tilo H. Yang, C. Robert Kao
Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. 3DIC (2019)
Masaki Ohyama, Masatsugu Nimura, Jun Mizuno, Shuichi Shoji, Toshihisa Nonaka, Yoichi Shinba, Akitsu Shigetou
Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. Microelectron. Reliab. 59 (2016)
Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. Microelectron. Reliab. 52 (2) (2012)
Akiko Okada, Masatsugu Nimura, Naoko Unami, Akitsu Shigetou, Hirokazu Noma, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji
Low temperature Au-Au bonding with VUV/O3 treatment. 3DIC (2011)