C. Robert Kao

Publication Activity (10 Years)

Years Active: 2009-2020
Publications (10 Years): 3

Top Topics

Micro Controller

High Sensitivity

Software Reliability

Top Venues

Adv. Intell. Syst.

Microelectron. Reliab.

Publications

Tilo H. Yang, Jun Shintake, Ryo Kanno, C. Robert Kao, Jun Mizuno
Low-Cost Sensor-Rich Fluidic Elastomer Actuators Embedded with Paper Electronics. Adv. Intell. Syst. 2 (8) (2020)
Tilo H. Yang, Jun Shintake, Ryo Kanno, C. Robert Kao, Jun Mizuno
Low-Cost Sensor-Rich Fluidic Elastomer Actuators Embedded with Paper Electronics. Adv. Intell. Syst. 2 (8) (2020)
Akitsu Shigetou, Tilo H. Yang, C. Robert Kao
Hydrolysis-Tolerant Hybrid Bonding in Ambient Atmosphere for 3D Integration. 3DIC (2019)
Y. J. Chen, C. K. Chung, C. R. Yang, C. Robert Kao
Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics. Microelectron. Reliab. 53 (1) (2013)
C. Robert Kao, Albert T. Wu, King-Ning Tu, Yi-Shao Lai
Reliability of micro-interconnects in 3D IC packages. Microelectron. Reliab. 53 (1) (2013)
Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. Robert Kao
Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bonding. Microelectron. Reliab. 51 (1) (2011)
Yi-Wun Wang, Y. W. Lin, C. Robert Kao
Kirkendall voids formation in the reaction between Ni-doped SnAg lead-free solders and different Cu substrates. Microelectron. Reliab. 49 (3) (2009)